| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Germany | 5 | |
| #2 | China | 2 | |
| #3 | Brazil | 1 | |
| #4 | Canada | 1 | |
| #5 | United States | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Transport | |
| #3 | Semiconductors | |
| #4 | Materials and metallurgy | |
| #5 | Environmental technology | |
| #6 | Machines |
| # | Name | Total Patents |
|---|---|---|
| #1 | Jetter Heinz Leonhard | 6 |
| #2 | Dyck Tobias | 4 |
| #3 | Braun Andreas | 2 |
| #4 | Moalem Anas | 2 |
| #5 | Tobias Dyck | 1 |
| #6 | Bergfeld Stefan | 1 |
| #7 | Taubitz Tobias | 1 |
| #8 | Merdzhanova Tsvetelina | 1 |
| #9 | Heinz Leonhard Jetter | 1 |
| #10 | Fuhs Christian | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102017215721A1 | Laser processing of large-surface substrates | |
| DE102017206968A1 | Method and device for producing riblets | |
| DE102016213802A1 | Disconnect with laser radiation | |
| DE102016210844A1 | Device and method for removing a layer | |
| DE102014202985A1 | Production of electronic components on a substrate |